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Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Wong, Chiu Soon and Bennett, N.S. and Manessis, D. and Danilewsky, Andreas N. and McNally, Patrick J. (2014) Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages. Microelectronic Engineering, 117 . pp. 48-56. ISSN 0167-9317

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Abstract

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip (SoC) or System-in-Package (SiP), which is identified as a requirement by the International Technology Roadmap for Semiconductors (ITRS). In the work presented here, a triple-axis Jordan Valley Bede D1 X-ray diffractometer is used to develop a novel lab-based technique called X-ray diffraction 3-dimensional surface modeling (XRD/3DSM) for non-destructive analysis of manufacturing process-induced stress/warpage inside completely encapsulated packaged chips. The technique is demonstrated at room temperature and at elevated temperatures up to 115C by in situ XRD annealing experiments. The feasibility of this technique is confirmed through the charactersation of die stress inside encapsulated commercially available ultra-thin Quad Flat Non-lead (QFN) packages, as well as die stress in embedded QFN packages at various stages of the chip manufacturing process

Item Type:Article (Published)
Refereed:Yes
Uncontrolled Keywords:Non-destructive; X-ray diffraction; stress; integrated circuit; embedded QFN package; warpage
Subjects:Engineering > Materials
Engineering > Microelectronics
Physical Sciences > Semiconductors
DCU Faculties and Centres:DCU Faculties and Schools > Faculty of Engineering and Computing > School of Electronic Engineering
Research Initiatives and Centres > Research Institute for Networks and Communications Engineering (RINCE)
Publisher:Elsevier
Official URL:http://dx.doi.org/10.1016/j.mee.2013.12.020
Copyright Information:© 2014 Elsevier
Use License:This item is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 3.0 License. View License
ID Code:19715
Deposited On:28 Jan 2014 15:10 by Patrick McNally. Last Modified 27 Jul 2017 16:38

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