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Author: Byrne, Patrick

Number of items: 1.

2007

Chen, Weimin and McCloskey, Paul and Rohan, James F. and Byrne, Patrick and McNally, Patrick J. (2007) Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 144-151. ISSN 1521-3331

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