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Author: Byrne, Patrick

Number of items: 1.


Chen, Weimin and McCloskey, Paul and Rohan, James F. and Byrne, Patrick and McNally, Patrick J. (2007) Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 144-151. ISSN 1521-3331

This list was generated on Sat Jun 23 03:53:55 2018 IST.