Number of items: 2.
Wong, Chiu Soon and Bennett, N.S. and Manessis, D. and Danilewsky, A. and McNally, Patrick J. (2014) Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages. Microelectronic Engineering, 117 . pp. 48-56. ISSN 0167-9317
Allen, David and Wittge, Jochen and Zlotos, A. and Gorogostegui-Coinas, E. and Garagorri, J. and McNally, Patrick J. and Danilewsky, A. and Elizalde, M.R. (2010) Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro-raman spectroscopy and white beam x-ray topography. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms, 268 (3-4). pp. 383-387. ISSN 0168-583x