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Author: Danilewsky, A.N.

Number of items: 3.

2004

McNally, Patrick J. and Kanatharana, Jarujit and Toh, B.H.W. and McNeill, D.W. and Danilewsky, A.N. and Tuomi, T. and Knuuttila, L. and Riikonen, J. and Toivonen, J. and Simon, R. (2004) Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology. Journal of Applied Physics, 96 (12). ISSN 0021-8979

2001

McNally, Patrick J. and Rantamäki, R. and Tuomi, T. and Danilewsky, A.N. and Lowney, Donnacha and Curley, John W. and Herbert, P.A.F. (2001) Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography. IEEE Transactions on Components and Packaging Technologies, 24 (1). pp. 76-83. ISSN 1521-3331

2000

McNally, Patrick J. and Dilliway, G. and Bonar, J.M. and Willoughby, A. and Tuomi, T. and Rantamäki, R. and Danilewsky, A.N. and Lowney, Donnacha (2000) On the use of total reflection x-ray topography for the observation of misfit dislocation strain at the surface of a Si/Ge–Si heterostructure. Applied Physics Letters, 77 (11). ISSN 0003-6951

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