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Author: Manessis, D.

Number of items: 1.

2014

Wong, Chiu Soon and Bennett, N.S. and Manessis, D. and Danilewsky, A.N. and McNally, Patrick J. (2014) Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages. Microelectronic Engineering, 117 . pp. 48-56. ISSN 0167-9317

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