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2007
Chen, Weimin, McCloskey, Paul, Rohan, James F., Byrne, Patrick and McNally, Patrick J. 
ORCID: 0000-0003-2798-5121
(2007)
Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization.
IEEE Transactions on Components and Packaging Technologies, 30
(1).
pp. 144-151.
ISSN 1521-3331