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Author: Rohan, James F.

Number of items: 1.


Chen, Weimin and McCloskey, Paul and Rohan, James F. and Byrne, Patrick and McNally, Patrick J. (2007) Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 144-151. ISSN 1521-3331

This list was generated on Sun Apr 30 06:23:55 2017 IST.