McNally, Patrick J. ORCID: 0000-0003-2798-5121, Kanatharana, Jarujit, Toh, B.H.W., McNeill, D.W., Danilewsky, Andreas N., Tuomi, Tiinamaija, Knuuttila, L., Riikonen, J., Toivonen, J. and Simon, R. (2004) Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology. Journal of Applied Physics, 96 (12). ISSN 0021-8979

Kanatharana, Jarujit (2003) Examination of solder bump reflow process and copper metallisation process induced stress distribution in silicon substrates using synchrotron x-ray topography, micro-raman spectroscopy and finite element modelling. PhD thesis, Dublin City University.