Browse DORAS
Browse Theses
Latest Additions
Creative Commons License
Except where otherwise noted, content on this site is licensed for use under a:

Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization

Chen, Weimin and McCloskey, Paul and Rohan, James F. and Byrne, Patrick and McNally, Patrick J. (2007) Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 144-151. ISSN 1521-3331

Full text available as:

PDF - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader


The reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM deposition. Solder bumps were formed after reflowing eutectic 63Sn37Pb solder foils over the Ni(P) UBM. The solder bump shear strength was measured before and after different temperature cycling. The results from this study showed that the UBM thickness and dimension had important effects on the solder bump shear strength and reliability. Both the larger UBM dimension and larger UBM thickness tended to induce higher stress in the UBM, which resulted in the lower solder bump shear strength and lower temperature cycling reliability. A better UBM structure solution for high current electronic packaging application is indicated in this paper

Item Type:Article (Published)
Uncontrolled Keywords:Electroless Ni(P) deposition; electronic packaging; reliability; shear strength test; solder bump; thermal cycling; under-bump metallization (UBM);
Subjects:Engineering > Electronics
DCU Faculties and Centres:DCU Faculties and Schools > Faculty of Engineering and Computing > School of Electronic Engineering
Research Initiatives and Centres > Research Institute for Networks and Communications Engineering (RINCE)
Publisher:Institute of Electrical and Electronics Engineers
Official URL:
Copyright Information:Copyright © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ID Code:189
Deposited On:06 Feb 2008 by DORAS Administrator. Last Modified 02 Feb 2009 14:06

Download statistics

Archive Staff Only: edit this record