X-ray imaging of silicon die within fully packaged semiconductor devices
Tanner, Brian K.ORCID: 0000-0002-1474-177X, McNally, Patrick J.ORCID: 0000-0003-2798-5121 and Danilewsky, Andreas N.
(2021)
X-ray imaging of silicon die within fully packaged semiconductor devices.
Powder Diffraction, 36
(2).
pp. 78-84.
ISSN 0885-7156
CALIPSOplus under Grant Agreement No. 730872 from the EU Framework Programme for Research and Innovation HORIZON 2020, Science Foundation Ireland (SFI) through the I-Form Advanced Manufacturing Research Centre (Grant No. 16/RC/3872)
ID Code:
26048
Deposited On:
01 Jul 2021 13:10 by
Vidatum Academic
. Last Modified 12 Apr 2022 12:59