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A method for numerical modelling of convection–reaction–diffusion using electrical analogues

Shafaq, Sabawoon, Kennedy, Alan H. ORCID: 0000-0002-8588-0953 and Delauré, Yan ORCID: 0000-0002-7151-9278 (2015) A method for numerical modelling of convection–reaction–diffusion using electrical analogues. International Journal of Numerical Modelling Electronic Networks Devices and Fields, 29 (3). pp. 417-436. ISSN 0894-3370

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Abstract

In this paper, a new method, called the lumped-component circuit method (LCM), is developed for one-dimensioal and two-dimensional convection–reaction–diffusion with low to moderate Peclet numbers, tested for modelling both steady-state and transient problems, and compared with standard finite volume method (FVM) schemes. The method has been developed principally for solving equations with piecewise-constant coefficients using nodes that are not positioned to correspond to the coefficient discontinuities. In such situations, the FVM solutions do not converge consistently as the node spacing is decreased, but LCM solutions do. In general, the LCM method is more accurate than the FVM schemes tested, and, while the computational cost of LCM is higher, results suggest that it can be more efficient. Like the transmission line method (TLM), it is an indirect scheme in which the problem to be solved is first represented by an analogous transmission line (TL). Unlike with TLM, however, the TL is then modelled using a lumped-component circuit, the voltages at nodes within that circuit being calculated.

Item Type:Article (Published)
Refereed:Yes
Subjects:Engineering > Electronic engineering
DCU Faculties and Centres:DCU Faculties and Schools > Faculty of Engineering and Computing > School of Mechanical and Manufacturing Engineering
Publisher:John Wiley & Sons, Ltd
Official URL:https://dx.doi.org/10.1002/jnm.2091
Copyright Information:© 2015 John Wiley & Sons, Ltd.
Use License:This item is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 3.0 License. View License
Funders:Irish Research Council for Science, Engineering and Technology (IRCSET)
ID Code:27264
Deposited On:25 May 2022 16:01 by Alan Kennedy . Last Modified 08 Feb 2023 15:33

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