Byrne, Conor, Brady, Anita 
ORCID: 0000-0002-9257-6837, Walsh, Lee, McCoy, Anthony, Bogan, Justin, McGlynn, Enda ORCID: 0000-0002-3412-9035, Vijayaraghavan, Rajani K. ORCID: 0000-0003-1096-448X and Hughes, Greg ORCID: 0000-0003-1310-8961
(2016)
Chemical and electrical characterisation of the segregation of Al from a CuAl alloy (90%:10% wt) with thermal anneal.
Thin Solid Films, 599
.
pp. 59-63.
ISSN 0040-6090
Abstract
A copper-aluminium (CuAl) alloy (90% : 10% wt) has been investigated in relation to segregation of the alloying element Al, from the alloy bulk during vacuum anneal treatments. X-ray photoelectron spectroscopy (XPS) measurements were used to track the surface enrichment of Al segregating from the alloy bulk during in situ ultra-high vacuum anneals. Secondary ion mass spectroscopy (SIMS) indicates a build-up of Al at the surface of the annealed alloy relative to the bulk composition. Metal oxide semiconductor (MOS) CuAl/ SiO2/Si structures show a shift in flatband voltage upon thermal anneal consistent with the segregation of the Al to the alloy/SiO2 interface. Electrical four point probe measurements indicates that the segregation of Al from the alloy bulk following thermal annealing results in a decrease in film resistivity. X-ray diffraction data shows evidence for significant changes in crystal structure upon annealing, providing further evidence for expulsion of Al from the alloy bulk.
Metadata
| Item Type: | Article (Published) |
|---|---|
| Refereed: | Yes |
| Uncontrolled Keywords: | Aluminium; Copper; Self-forming barrier; CuAl alloy; XPS; XRD |
| Subjects: | Engineering > Materials Physical Sciences > Spectrum analysis Physical Sciences > Nanotechnology Physical Sciences > Chemistry Physical Sciences > Crystallography |
| DCU Faculties and Centres: | DCU Faculties and Schools > Faculty of Engineering and Computing > School of Electronic Engineering Research Institutes and Centres > National Centre for Plasma Science and Technology (NCPST) DCU Faculties and Schools > Faculty of Science and Health > School of Physical Sciences |
| Publisher: | Elsevier |
| Official URL: | http://dx.doi.org/10.1016/j.tsf.2015.12.056 |
| Copyright Information: | © 2016 Elsevier |
| Use License: | This item is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 3.0 License. View License |
| ID Code: | 21116 |
| Deposited On: | 24 Mar 2016 11:44 by Enda Mcglynn . Last Modified 09 Jun 2020 16:05 |
Documents
Full text available as:
Preview |
PDF (Thin Solid Films, 599 (2016) 59–63)
- Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
1MB |
Downloads
Downloads
Downloads per month over past year
Archive Staff Only: edit this record