Chipless Radio Frequency Identification (RFID) is modern wireless technology that has been earmarked as being suitable for low-cost item tagging/tracking. These devices do not require integrated circuitry or a battery and thus, are not only are cheap, but also easy to manufacture and potentially very robust. A great deal of attention is also being put on the possibility of giving these tags the ability to sense various environmental stimuli such as temperature and humidity. This work focusses on the potential use of chipless RFID as a sensor technology for aerospace Structural Health Monitoring. The project is focussed on the sensing of mechanical strain and temperature, with an emphasis placed on fabrication simplicity, so that the final sensor designs could be potentially fabricated in-situ using existing printing technologies. Within this project, a variety of novel chipless RFID strain and temperature sensors have been designed, fabricated and tested. A thorough discussion is also presented on the topic of strain sensor cross sensitivity, which places emphasis on issues like, transverse strain, dielectric constant variations and thermal swelling. Additionally, an exploration into other key technological challenges was also performed, with a focus on challenges such as: accurate and reliable stimulus detection, sensor polarization and multi-sensor support. Several key areas of future research have also been identified and outlined, with aims related to: Enhancing strain sensor fabrication simplicity, enhancing temperature sensor sensitivity and simplicity and developing a fully functional interrogation system.