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Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography

McNally, Patrick J. and Rantamäki, R. and Tuomi, T. and Danilewsky, A.N. and Lowney, Donnacha and Curley, John W. and Herbert, P.A.F. (2001) Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography. IEEE Transactions on Components and Packaging Technologies, 24 (1). pp. 76-83. ISSN 1521-3331

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Abstract

Thermal processing steps used during the production of packaged integrated circuits can lead to severe thermomechanical stresses. In addition, the process of bonding wires to contact pads can also lead to strain field generation. A feasibility study using the application of white beam synchrotron x-ray topography to packaged erasable programmable read-only memory (EPROM) Si integrated circuits (ICs) has been undertaken in order to produce maps of the strain fields induced by such processing steps. This technique provides depth-resolved mapping with spatial resolutions currently in the region of 5-10 μm throughout the entire mapping volume. Furthermore, the use of different experimental geometries allows the user to nondestructively probe the strain fields present at the wafer surface right through to the back side.

Item Type:Article (Published)
Refereed:Yes
Uncontrolled Keywords:High resolution; nondestructive evaluation; packaged integrated circuits; strain fields; synchrotron x-ray topography;
Subjects:Physical Sciences > Electronic circuits
Engineering > Electronics
DCU Faculties and Centres:DCU Faculties and Schools > Faculty of Engineering and Computing > School of Electronic Engineering
Research Initiatives and Centres > Research Institute for Networks and Communications Engineering (RINCE)
Publisher:Institute of Electrical and Electronics Engineers
Official URL:http://dx.doi.org/10.1109/6144.910805
Copyright Information:Copyright © 2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ID Code:191
Deposited On:06 Feb 2008 by DORAS Administrator. Last Modified 02 Feb 2009 14:09

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